Five Key Workflows that Deliver 3D IC Packaging Success

These five workflows span several interlinked domain areas:

  • Architecture definition
  • Design activities (including planning, prototyping, system technology co-optimization, and detailed physical implementation of the substrates)
  • Multi-physics analysis
  • Device-level test
  • Manufacturing

This paper recommends workflow adoption focus areas that provide immediate heterogeneous integration capability benefits while establishing a managed methodology adoption and migration process that minimizes disruption, risk, and cost. This will bring heterogeneous integration-based chiplet design within reach of the mainstream instead of being accessible only to the mega iDMs and fabless semiconductor companies.

Request Free!