Especially inside the large data centers that underpin today’s cloud and internet infrastructure, traffic keeps growing exponentially. As a result, the industry is now looking at 800G- and even 1.6T-capable optical (pluggable) transceivers, and co-packaged optics with even higher capacities. Maintaining transceiver footprints requires significant advances in terms of energy efficiency, integration density and bandwidth of both the electronic and photonic components of next-gen wireline transceivers.

Topics that will be addressed during this webinar include:

• The use of SiGe BiCMOS to achieve beyond 100Gbaud operation as a more accessible alternative to compound semiconductors in analog electronic integrated circuits such as drivers and receivers.
• The move towards 5- and even 3nm CMOS for next-generation ADCs and DACs.
• Novel approaches for dense integration of electronic and photonic components with unprecedented integration density and manufacturing scalability.
• Moving functionality from the electronic to the optical domain using new schemes such as optical domain equalizers.